Pilot scholarship scheme “Poland. Business Adventure” inaugurated
12.03.2025
The Ministry of Foreign Affairs in cooperation with the Polish Investment and Trade Agency has launched a scholarship scheme addressed to representatives of the Polish diaspora aged 18 to 35. The agreement was signed by head of Polish diplomacy Radosław Sikorski on the MFA’s side and, on the Agency’s side, by Andrzej Dycha and Łukasz Gwiazdowski, Chairman and Deputy Chairman of its Management Board. The event was also attended by Undersecretary of State at the Ministry of Foreign Affairs Henryka Mościcka-Dendys.
The pilot of the programme, planned for July–November 2025, is directed towards young people living in the member states of the European Union, the European Economic Area, the United Kingdom of Great Britain and Northern Ireland, the United States of America, and Canada. In the future, the programme will be available to the Polish diaspora from all over the world.
Participants of the pilot will be able to gain three months of professional experience in modern Polish companies. Scholarship holders will receive financial support from the Ministry of Foreign Affairs as well as logistic assistance.
Thanks to the scheme, recipients will have an opportunity to integrate with the Polish business community, build international connections, and get a better insight into the country of their ancestors. Applications for the programme will be made through diplomatic missions.
The programme implements the objectives for the cooperation between the Polish government and the Polish diaspora and Poles living abroad for the year 2025, presented by the Foreign Minister Radosław Sikorski in the Senate in October 2024.
Application form with CV and any questions should be sent to: dwppg.stazebiznesowe@msz.gov.pl
Applications will be accepted until April 10, 4:00 PM Polish time.
Materials
Rules of participationRegulamin_Uczestnictwa_w_Programie_Stypendialnym_MSZ__EN.pdf 0.20MB Application form
Formularz_zgłoszeniowy_EN.docx 0.20MB Brochure
Załącznik_nr_7_-_Ulotka.pdf 0.50MB